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Phys. Rev. B 99, 214436 (2019) - Landau-Lifshitz-Bloch equation for domain wall motion in antiferromagnets

Landau-Lifshitz-Bloch equation for domain wall motion in antiferromagnets

Z. Y. Chen, Z. R. Yan, M. H. Qin, and J.-M. Liu
Phys. Rev. B 99, 214436 – Published 25 June 2019
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Abstract

In this work, we derive the Landau-Lifshitz-Bloch equation accounting for the multidomain antiferromagnetic (AFM) lattice at finite temperature, in order to investigate the domain wall motion, the core issue for AFM spintronics. The continuity equation of the staggered magnetization is obtained using the continuum approximation, allowing an analytical calculation of the domain wall dynamics. The influence of temperature on the static domain wall profile is investigated, and the analytical calculations agree well with the numerical simulations on temperature-gradient-driven domain wall motion, confirming the validity of this theory. Furthermore, the decrease of the acceleration and the increase of the saturation velocity of the domain wall with the increase of temperature are uncovered for a fixed gradient. Moreover, it is worth noting that this theory could be also applied to dynamics of various wall motions in an AFM system. The present theory represents a comprehensive approach to the domain wall dynamics in AFM materials, a crucial step toward the development of AFM spintronics.

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  • Received 6 February 2019
  • Revised 6 June 2019

DOI:https://doi.org/10.1103/PhysRevB.99.214436

©2019 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Z. Y. Chen1, Z. R. Yan1, M. H. Qin1,*, and J.-M. Liu1,2

  • 1Institute for Advanced Materials, South China Academy of Advanced Optoelectronics and Guangdong Provincial Key Laboratory of Quantum Engineering and Quantum Materials, South China Normal University, Guangzhou 510006, China
  • 2Laboratory of Solid State Microstructures and Innovative Center for Advanced Microstructures, Nanjing University, Nanjing 210093, China

  • *qinmh@scnu.edu.cn

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Issue

Vol. 99, Iss. 21 — 1 June 2019

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