This paper discusses a multichip module for future VLSI computer packages on which an
array of silicon chips is directly attached and interconnected by high-density thin-film lossy …

… Figure 1 shows the hierarchical structure of silicon chips, semiconductor package substrates
(“PKG substrates”), and PWB. The printed wiring board materials, including copper-clad …

… a reliable and robust semiconductor package. Semiconductor Packaging: … in a semiconductor
package. By tying together the disparate elements essential to a semiconductor package, …

… Based on the results, this paper can provide a better understanding of thermal and
mechanical fluxes in semiconductor package patterns for package design and optimization. …

In the semiconductor IC (Integrated Circuit) package, the top surface of silicon chip is directly
attached to the area of the leadframe with a double-sided adhesive layer, in which the base …

In recent years, because the needs of 5G mobile communications, artificial intelligence, self-driving
cars, and high-speed networks product are highly increasing, more and more IC …

… Although semiconductor packaging technology research is important, swiftly identifying the
most cost-effective semiconductor package conditions is equally crucial for commercialization…

We are crossing the threshold of the third revolution in semiconductor packaging. In the '80s,
surface mount technology (SMT) had major impact on size reduction of all electronic …

Currently, as semiconductor packages are becoming increasing smaller with improved
performances, many are being constructed using stacked structures. However, these types of …

In these days, importance of the power electronic devices and modules keeps increasing
due to electric vehicles and energy saving requirements. However, current silicon-based …