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[2305.03704] A 3D Modeling Method for Scattering on Rough Surfaces at the Terahertz Band
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Electrical Engineering and Systems Science > Signal Processing

arXiv:2305.03704 (eess)
[Submitted on 5 May 2023]

Title:A 3D Modeling Method for Scattering on Rough Surfaces at the Terahertz Band

Authors:Ben Chen, Ke Guan, Danping He, Pengxiang Xie, Zhangdui Zhong, Jianwu Dou, Shahid Mumtaz, Wael Bazzi
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Abstract:The terahertz (THz) band (0.1-10 THz) is widely considered to be a candidate band for the sixth-generation mobile communication technology (6G). However, due to its short wavelength (less than 1 mm), scattering becomes a particularly significant propagation mechanism. In previous studies, we proposed a scattering model to characterize the scattering in THz bands, which can only reconstruct the scattering in the incidence plane. In this paper, a three-dimensional (3D) stochastic model is proposed to characterize the THz scattering on rough surfaces. Then, we reconstruct the scattering on rough surfaces with different shapes and under different incidence angles utilizing the proposed model. Good agreements can be achieved between the proposed model and full-wave simulation results. This stochastic 3D scattering model can be integrated into the standard channel modeling framework to realize more realistic THz channel data for the evaluation of 6G.
Subjects: Signal Processing (eess.SP)
Cite as: arXiv:2305.03704 [eess.SP]
  (or arXiv:2305.03704v1 [eess.SP] for this version)
  https://doi.org/10.48550/arXiv.2305.03704

Submission history

From: Ben Chen [view email]
[v1] Fri, 5 May 2023 17:36:45 UTC (1,321 KB)
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