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Showing 1–5 of 5 results for author: Prasad, R V

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  1. arXiv:2312.14364  [pdf, other

    eess.SY

    GreenScan: Towards large-scale terrestrial monitoring the health of urban trees using mobile sensing

    Authors: Akshit Gupta, Simone Mora, Fan Zhang, Martine Rutten, R. Venkatesha Prasad, Carlo Ratti

    Abstract: Healthy urban greenery is a fundamental asset to mitigate climate change phenomena such as extreme heat and air pollution. However, urban trees are often affected by abiotic and biotic stressors that hamper their functionality, and whenever not timely managed, even their survival. While the current greenery inspection techniques can help in taking effective measures, they often require a high amou… ▽ More

    Submitted 6 April, 2024; v1 submitted 21 December, 2023; originally announced December 2023.

    Comments: 13 pages, submitted to IEEE Sensors

  2. Open Gimbal: A 3 Degrees of Freedom Open Source Sensing and Testing Platform for Nano and Micro UAVs

    Authors: Suryansh Sharma, Tristan Dijkstra, R. Venkatesha Prasad

    Abstract: Testing the aerodynamics of micro- and nano-UAVs without actually flying is highly challenging. To address this issue, we introduce Open Gimbal, a specially designed 3 Degrees of Freedom platform that caters to the unique requirements of micro- and nano-UAVs. This platform allows for unrestricted and free rotational motion, enabling comprehensive experimentation and evaluation of these UAVs. Our a… ▽ More

    Submitted 4 October, 2023; originally announced October 2023.

    Comments: Link to open source repository: https://doi.org/10.5281/zenodo.8052218

    Journal ref: in IEEE Sensors Letters, vol. 7, no. 9, pp. 1-4, Sept. 2023, Art no. 2502704

  3. BEAVIS: Balloon Enabled Aerial Vehicle for IoT and Sensing

    Authors: Suryansh Sharma, Ashutosh Simha, R. Venkatesha Prasad, Shubham Deshmukh, Kavin B. Saravanan, Ravi Ramesh, Luca Mottola

    Abstract: UAVs are becoming versatile and valuable platforms for various applications. However, the main limitation is their flying time. We present BEAVIS, a novel aerial robotic platform striking an unparalleled trade-off between the manoeuvrability of drones and the long lasting capacity of blimps. BEAVIS scores highly in applications where drones enjoy unconstrained mobility yet suffer from limited life… ▽ More

    Submitted 2 August, 2023; originally announced August 2023.

    Comments: To be published in the 29th Annual International Conference on Mobile Computing and Networking (ACM MobiCom 23), October 2-6, 2023, Madrid, Spain. ACM, New York, NY, USA, 15 pages

  4. arXiv:2001.01770  [pdf, other

    cs.NI eess.SP

    Setting the Yardstick: A Quantitative Metric for Effectively Measuring Tactile Internet

    Authors: J. P. Verburg, H. J. C. Kroep, V. Gokhale, R. Venkatesha Prasad, V. Rao

    Abstract: The next frontier in communications is teleoperation -- manipulation and control of remote environments. Compared to conventional networked applications, teleoperation poses widely different requirements, ultra-low latency (ULL) being the primary one. Teleoperation, along with a host of other applications requiring ULL communication, is termed as Tactile Internet (TI). A significant redesign of co… ▽ More

    Submitted 27 January, 2020; v1 submitted 6 January, 2020; originally announced January 2020.

  5. Analyzing the Trade-offs in Using Millimeter Wave Directional Links for High Data Rate Tactile Internet Applications

    Authors: Kishor Chandra Joshi, Solmaz Niknam, R. Venkatesha Prasad, Balasubramaniam Natarajan

    Abstract: Ultra-low latency and high reliability communications are the two defining characteristics of Tactile Internet (TI). Nevertheless, some TI applications would also require high data-rate transfer of audio-visual information to complement the haptic data. Using Millimeter wave (mmWave) communications is an attractive choice for high datarate TI applications due to the availability of large bandwidth… ▽ More

    Submitted 9 September, 2019; originally announced September 2019.

    Comments: IEEE Transactions on Industrial Informatics, 2019