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The ABC130 barrel module prototyping programme for the ATLAS strip tracker
Authors:
Luise Poley,
Craig Sawyer,
Sagar Addepalli,
Anthony Affolder,
Bruno Allongue,
Phil Allport,
Eric Anderssen,
Francis Anghinolfi,
Jean-François Arguin,
Jan-Hendrik Arling,
Olivier Arnaez,
Nedaa Alexandra Asbah,
Joe Ashby,
Eleni Myrto Asimakopoulou,
Naim Bora Atlay,
Ludwig Bartsch,
Matthew J. Basso,
James Beacham,
Scott L. Beaupré,
Graham Beck,
Carl Beichert,
Laura Bergsten,
Jose Bernabeu,
Prajita Bhattarai,
Ingo Bloch
, et al. (224 additional authors not shown)
Abstract:
For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000…
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For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.
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Submitted 7 September, 2020;
originally announced September 2020.
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Development of the kaon tagging system for the NA62 experiment at CERN
Authors:
Evgueni Goudzovski,
Marian Krivda,
Cristina Lazzeroni,
Karim Massri,
Francis O. Newson,
Simon Pyatt,
Angela Romano,
Xen Serghi,
Antonino Sergi,
Richard J. Staley,
Helen F. Heath,
Ryan F. Page,
Antonio Cassese,
Peter A. Cooke,
John B. Dainton,
John R. Fry,
Liam D. J. Fulton,
Emlyn Jones,
Tim J. Jones,
Kevin J. McCormick,
Peter Sutcliffe,
Bozydar Wrona
Abstract:
The NA62 experiment at CERN aims to make a precision measurement of the ultra-rare decay $K^{+} \rightarrow π^{+}ν\overlineν$, and relies on a differential Cherenkov detector (KTAG) to identify charged kaons at an average rate of 50 MHz in a 750 MHz unseparated hadron beam. The experimental sensitivity of NA62 to K-decay branching ratios (BR) of $10^{-11}$ requires a time resolution for the KTAG o…
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The NA62 experiment at CERN aims to make a precision measurement of the ultra-rare decay $K^{+} \rightarrow π^{+}ν\overlineν$, and relies on a differential Cherenkov detector (KTAG) to identify charged kaons at an average rate of 50 MHz in a 750 MHz unseparated hadron beam. The experimental sensitivity of NA62 to K-decay branching ratios (BR) of $10^{-11}$ requires a time resolution for the KTAG of better than 100 ps, an efficiency better than 95% and a contamination of the kaon sample that is smaller than $10^{-4}$. A prototype version of the detector was tested in 2012, during the first NA62 technical run, in which the required resolution of 100 ps was achieved and the necessary functionality of the light collection system and electronics was demonstrated.
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Submitted 12 September, 2015;
originally announced September 2015.
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Alternative glues for the production of ATLAS silicon strip modules for the Phase-II upgrade of the ATLAS Inner Detector
Authors:
Luise Poley,
Ingo Bloch,
Sam Edwards,
Conrad Friedrich,
Ingrid-Maria Gregor,
Tim Jones,
Heiko Lacker,
Simon Pyatt,
Laura Rehnisch,
Dennis Sperlich,
John Wilson
Abstract:
The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechan…
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The Phase-II upgrade of the ATLAS detector for the High Luminosity Large Hadron Collider (HL-LHC) includes the replacement of the current Inner Detector with an all-silicon tracker consisting of pixel and strip detectors. The current Phase-II detector layout requires the construction of 20,000 strip detector modules consisting of sensor, circuit boards and readout chips, which are connected mechanically using adhesives. The adhesive between readout chips and circuit board is a silver epoxy glue as was used in the current ATLAS SemiConductor Tracker (SCT). This glue has several disadvantages, which motivated the search for an alternative.
This paper presents a study concerning the use of six ultra-violet (UV) cure glues and a glue pad for use in the assembly of silicon strip detector modules for the ATLAS upgrade. Trials were carried out to determine the ease of use, the thermal conduction and shear strength, thermal cycling, radiation hardness, corrosion resistance and shear strength tests. These investigations led to the exclusion of three UV cure glues as well as the glue pad.
Three UV cure glues were found to be possible better alternatives. Results from electrical tests of first prototype modules constructed using these glues are presented.
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Submitted 26 April, 2016; v1 submitted 24 August, 2015;
originally announced August 2015.
