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Results of the 2021 ECFA Early-Career Researcher Survey on Training in Instrumentation
Authors:
ECFA Early-Career Researcher Panel,
:,
Anamika Aggarwal,
Chiara Amendola,
Liliana Apolinario,
Jan-Hendrik Arling,
Adi Ashkenazi,
Kamil Augsten,
Julien Baglio,
Evelin Bakos,
Liron Barak,
Diogo Bastos,
Bugra Bilin,
Silvia Biondi,
Neven Blaskovic Kraljevic,
Lydia Brenner,
Francesco Brizioli,
Antoine Camper,
Alessandra Camplani,
Xabier Cid Vidal,
Hüseyin Dag,
Flavia de Almeida Dias,
Eleonora Diociaiuti,
Lennart van Doremalen,
Katherine Dunne
, et al. (52 additional authors not shown)
Abstract:
The European Committee for Future Accelerators (ECFA) Early-Career Researchers (ECR) Panel was invited by the ECFA Detector R&D Roadmap conveners to collect feedback from the European ECR community. A working group within the ECFA ECR panel held a Townhall Meeting to get first input, and then designed and broadly circulated a detailed survey to gather feedback from the larger ECR community. A tota…
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The European Committee for Future Accelerators (ECFA) Early-Career Researchers (ECR) Panel was invited by the ECFA Detector R&D Roadmap conveners to collect feedback from the European ECR community. A working group within the ECFA ECR panel held a Townhall Meeting to get first input, and then designed and broadly circulated a detailed survey to gather feedback from the larger ECR community. A total of 473 responses to this survey were received, providing a useful overview of the experiences of ECRs in instrumentation training and related topics. This report summarises the feedback received, and is intended to serve as an input to the ECFA Detector R&D Roadmap process.
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Submitted 1 July, 2021;
originally announced July 2021.
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First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors
Authors:
ALICE ITS project,
:,
G. Aglieri Rinella,
M. Agnello,
B. Alessandro,
F. Agnese,
R. S. Akram,
J. Alme,
E. Anderssen,
D. Andreou,
F. Antinori,
N. Apadula,
P. Atkinson,
R. Baccomi,
A. Badalà,
A. Balbino,
C. Bartels,
R. Barthel,
F. Baruffaldi,
I. Belikov,
S. Beole,
P. Becht,
A. Bhatti,
M. Bhopal,
N. Bianchi
, et al. (230 additional authors not shown)
Abstract:
A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to ra…
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A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to radii of about 2cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance.
In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties.
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Submitted 17 August, 2021; v1 submitted 27 May, 2021;
originally announced May 2021.
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A next-generation LHC heavy-ion experiment
Authors:
D. Adamová,
G. Aglieri Rinella,
M. Agnello,
Z. Ahammed,
D. Aleksandrov,
A. Alici,
A. Alkin,
T. Alt,
I. Altsybeev,
D. Andreou,
A. Andronic,
F. Antinori,
P. Antonioli,
H. Appelshäuser,
R. Arnaldi,
I. C. Arsene,
M. Arslandok,
R. Averbeck,
M. D. Azmi,
X. Bai,
R. Bailhache,
R. Bala,
L. Barioglio,
G. G. Barnaföldi,
L. S. Barnby
, et al. (374 additional authors not shown)
Abstract:
The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical layers based on curved wafer-scale ultra-thin silicon sensors with MAPS technology, featuring an unprecedented low material budget of 0.05% X$_0$ per layer, with th…
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The present document discusses plans for a compact, next-generation multi-purpose detector at the LHC as a follow-up to the present ALICE experiment. The aim is to build a nearly massless barrel detector consisting of truly cylindrical layers based on curved wafer-scale ultra-thin silicon sensors with MAPS technology, featuring an unprecedented low material budget of 0.05% X$_0$ per layer, with the innermost layers possibly positioned inside the beam pipe. In addition to superior tracking and vertexing capabilities over a wide momentum range down to a few tens of MeV/$c$, the detector will provide particle identification via time-of-flight determination with about 20~ps resolution. In addition, electron and photon identification will be performed in a separate shower detector. The proposed detector is conceived for studies of pp, pA and AA collisions at luminosities a factor of 20 to 50 times higher than possible with the upgraded ALICE detector, enabling a rich physics program ranging from measurements with electromagnetic probes at ultra-low transverse momenta to precision physics in the charm and beauty sector.
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Submitted 2 May, 2019; v1 submitted 31 January, 2019;
originally announced February 2019.
