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Daehyun Chung

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2000 – 2009

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2009
[c2]
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  - conf/3dic/BandyopadhyayCCST09
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Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao R. Tummala:
Electrical modeling of Through Silicon and Package Vias. 3DIC 2009: 1-8
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Jianyong Xie, Daehyun Chung, Madhavan Swaminathan, Michael McAllister, Alina Deutsch, Lijun Jiang, Barry J. Rubin:
Electrical-thermal co-analysis for power delivery networks in 3D system integration. 3DIC 2009: 1-4
2006
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Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jinhan Kim, Kicheol Bae, Jiheon Yu, Hoi-Jun Yoo, Joungho Kim:
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery. IEEE J. Solid State Circuits 41(1): 274-286 (2006)

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