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ORCIDJonghyun Cho
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2010 – 2019
- 2017
[j4]Jonghyun Cho, Myunghoi Kim
:
Electromagnetic Interference Analysis of an Inhomogeneous Electromagnetic Bandgap Power Bus for High-Speed Circuits. J. Inform. and Commun. Convergence Engineering 15(4) (2017)- [j3]Francesco de Paulis, Stefano Piersanti, Qian Wang, Jonghyun Cho, Nicholas Erickson, Brice Achkir, Jun Fan, James L. Drewniak, Antonio Orlandi:
TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization. IEEE Trans. Instrum. Meas. 66(4): 792-801 (2017) - 2016
- [j2]Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim:
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test 33(2): 17-29 (2016) - [j1]Jonghyun Cho, Myunghoi Kim:
Suppression of Parallel Plate Modes Using Edge-Located EBG Structure in High-Speed Power Bus. J. Inform. and Commun. Convergence Engineering 14(4) (2016) - 2015
- [c10]Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Joungho Kim:
Noise coupling modeling and analysis of through glass via(TGV). 3DIC 2015: TS8.34.1-TS8.34.5 - 2014
- [c9]Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala:
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. 3DIC 2014: 1-4 - 2013
- [c8]Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala:
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC 2013: 1-5 - [c7]Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala:
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC 2013: 1-5 - [c6]Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC 2013: 1-4 - [c5]Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Eye-diagram simulation and analysis of a high-speed TSV-based channel. 3DIC 2013: 1-7 - [c4]Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. EMC Compo 2013: 5-9 - [c3]Jonghyun Cho, Joungho Kim:
Signal integrity design of TSV and interposer in 3D-IC. LASCAS 2013: 1-4 - 2011
- [c2]Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim:
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. DAC 2011: 783-788 - [c1]Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon:
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. ISQED 2011: 122-128
Coauthor Index
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