Industry Trends

• The Global Semiconductor Industry Reached $115.8 Billion in Q1 2018, IHS Markit Says

  Global semiconductor industry revenue declined 3.4 percent in the first quarter of 2018 falling to $115.8 billion. Semiconductor industry performance was negatively affected by the declining sales and first-quarter seasonality ...

• RF Front-End Module Comparison Report by SystemPlus Consulting

  2018 is a new year for RF Front-End Module suppliers, and a turning point for some smartphone-making original equipment manufacturers (OEMs). In 2017, we saw an important choice in adopting Power Amplifier Module integrated Duplexers (PAMiDs) that distinguished high-end and mid-range smartphones....

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• IP Royalties Out – Commoditization in?

• FPGAs for ASIC Prototyping Bridge Global Development

  ASIC Prototyping with FPGAs faces global development challenges in the hardware-software IoT and automotive markets.

• ADL Embedded Solutions ADLMES-8200 Rugged Modular Enclosure Systems

  The ADLMES-8200 is a highly innovative embedded enclosure designed for Railway Train Control and many other Transportation applications. Its highly configurable modularity makes it

• The Future of Thermal Management

  At GE Intelligent Platforms, we understand that one of the greatest challenges involved in developing cutting edge defense systems is keeping advanced electronics cool.

• Rip Van Winkle Bluetooth Low Energy Wakes Up, Then Sleeps Again

  Bluetooth Low Energy (LE, or BLE, or Smart) is all about sending and receiving data just like any other Bluetooth device, but doing so using much less power. It's ideally suited for M2M applications where a device wakes up, transmits or receives data, then goes back to sleep. The Bluetooth SIG specifies myriad application profiles from healthcare ("Blood Pressure Profile") to Sports and Fitness. At the recent DESIGN West 2013 conference, editor-in-chief Chris A. Ciufo got the lowdown on Laird's new BL600 Bluetooth LE Smart modules.

• More Wireless Embedded in Connected M2M Devices: Wi-Fi, ZigBee, Bluetooth, and 802.15.4

  At the recent DESIGN West 2013 conference in San Jose,  Microchip unleashed a "broad expansion" of new wireless products targeting the M2M, connected cloud, and intelligent devices spaces. There's also a new PIC32 digital audio development kit for Bluetooth audio streaming, plus 802.15.4 modules for ZigBee.

  Editor Chris A. Ciufo got a chance to chat briefly with Tyler Smith, Product Marketing Manager, Wireless Products Division of Microchip. Click on the video to hear this on-target 3-minute interview.

• Extension Media Interview with Microchip's Joe Drzewiecki

  Editor Chris Ciufo spent time with Microchip software manager Joe Drzewiecki at the Spring DESIGN West show (formerly known as ESC). Microchip launched their new MPLAB X compiler strategy that now goes across all Microchip MCUs. It also adds a new license strategy, optimizations that compile 35 percent faster on 32-bit devices (or save 35 percent on code size). There's also a "totally free" version of the MPLAB X compiler. Check out the 3 minute video.